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PCB & Interface Design

As a part of our commitment to deliver the total turnkey solution, we offer design services to incorporate our expertise in DFM to DFT.  Our expertise in Wafer testing interfaces like MLSHITM, probe card, load board to burn in PCB design is truly the best experience and solution to share with our customer.
CAD Tools
  • Allegro

  • Concept HDL

  • PCAD

  • AutoCAD

  • OrCAD

  • Altium Designer

  • PADS

Capabilities
  •  Thru-Hole and SMT designs

  •  Layers: up to 90

  •  Blind and Buried Vias

  •  Back Drilling

  •  Stitching Vias

  •  Fine Pitch Geometry

  •  Matched length/ Delay up to +/- 1mil

  •  Controlled impedance (+/-7% PCB &   +/-4% Substrate tolerance)

  •  Multiple K on the same layer

  •  Curved traces

  •  Board Thickness: 32- 320 mils

  •  Design up to 80 GHz Boards Std.

  •  High current up to 150A

Deliverables
  • Original CAD Design Files

  • Schematics in PDF

  • Fabrication Documentation(Gerber Data, FAB drawing, Drill Data, IPC Netlist, ODB/ODB++ Data)

  • Assembly drawings

  • Pick and place files

  • Bill of Material (BOM)

 

Services
  • CAD DESIGN

  • (Schematic Capture & Layout)

  • Burn In Boards

  • HAST/THB-85/85 boards

  • Probe Cards• ATE /TIU

  • Any custom PCB

  • LIBRARY MANAGEMENT

  • Socket

  • Components

  • ICs

  • Symbols

Mechanical

MECHANICAL DRAFTING

  • Frame

  • Stiffener

  • Heat sink

RFQ Requirement
  • Tester Type

  • Pin list/ Schematic

  • Socket drawing

  • Number of TIU positions required

  • Device Current /Wattage

  • Preferred # of Layers

  • Desired lead time

SI / PI Simulation Services

The integrity and quality of the PCB layout become critical for optimizing the performance of the system as signal speeds increases.   Simulation software tools can help to analyze and avoid the painful hours of debugging in a lab. But Post-layout analysis alone is no longer enough to guarantee design success. Designers must be able to evaluate alternative layout strategies before PCB layout begins, taking into account allowable manufacturing tolerances.  AIS design simulation team follow a strategy for each net as it is developed and rules are defined for a layout that ensures the net will work under real-world conditions. We support the layout process in real-time to solve any route-ability vs performance issues before they have a chance to affect schedule and cost.

At the same time, Simulation can prove to be time consuming and expensive.  With our extensive experience in SI/PI, we will work with you at the beginning of the design to mutually determine the practical level of simulation required for your specific board, to mitigate the risk and also eliminate layout iterations.


AIS SI teams have years of experience in pre-design and post-design verification and analysis. This experience and expertise, combined with powerful state-of-the-art software, helps ensure your design will work the way you expect it to be the very first time.

Below are lists of services we provide along with detailed reports containing simulation setups, the models used, result plots, observation, and analysis report.

 

  • High-speed Channel Simulations for analysis of Insertion loss & Return loss patterns of SerDes channels.

  • Time domain waveform Simulations for analysis of propagation delay, Rise/Fall times, over/undershoots

  • Power integrity Simulations for estimation of DC drop and effective plane impedance

  • Thermal Simulations for estimation of board temperature profiles and device temperatures

  • Crosstalk Simulations for analysis of induced noise voltages between adjacent signal traces

  • EMI – Radiated Emissions Simulations for analysis of radiated emissions from trace geometry on PCB following standards like FCC, CISPR, VCCI (Class A & B)

  • Parasitic RLC Simulations for estimation of parasitic R, L & C

Need more details? Contact us

We are here to serve you. Contact us and we get back to you shortly.

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